AMD Kintex-7 FFG900 FPGA board
Overview
XCM-209 is an evaluation board equipped with a XILINX's high performance FPGA, Kintex-7 series (FFG900 package).
XCM-209 has voltage regulators, an oscillator, user LEDs, switches and a configuration device on its compact credit-card size board.
Only one 3.3V single power supply is needed. There are 296 user I/Os divided into four Vcco groups.
Vivado Design/System license is required to develop this board.
The free "WebPack" version does not support the FPGA device of this board.
XCM-209 series is a BTO (Build to Order).
Rev2: The configuration device on this board is changed to MT25QL128 or MT25QL256 due to the discontinuance of N25Q128 or N25Q256.
Block Diagram
Specifications
- FPGA: Kintex-7
- XC7K325T-1FFG900C
- XC7K410T-1FFG900CFeature XC7K325T XC7K410T Logic Cells 326,080 406,720 Slices 50,950 63,550 Maximum Distributed RAM (kb) 4,000 5,663 Maximum Block RAM (kb) 16,020 28,620 DSP Slices 840 1,540 CMT (MMCM x1 + PLL x1) 10 10 Maximum user I/O pins (Device) 500 500 Maximum user I/O pins (Board) 296 296
- User I/O: 296 (HIROSE connectors, 80 pin x2, 100 pin x2)
- IOA (CNA Connector): 64
(Some of the IOA are connected HP bank with level conversion ICs.)
- IOB (CNB Connector): 64
- IOC (CNC Connector): 84
- IOD (CND Connector): 84 - Separated Vcco input for each connector
- IOA: Fixed to 3.3V input from CNA Connector
- IOB: External input from CNB Connector
- IOC: External input from CNC Connector
- IOD: External input from CND Connector - DDR3 SDRAM: MT41K64M16 (Micron, 1Gbit)
High density is available by a BTO up to 4Gbit - Configuration Device
Rev2: Quad SPI ROM: MT25QL128 or MT25QL256 (Micron, 128/256 Mbit)
Rev1: Quad SPI ROM: N25Q128 or N25Q256 (Micron, 128/256 Mbit) - JTAG port (7 pin socket)
- JTAG buffer for stable download and debug - Power: 3.3V single supply
- 1.0V/1.5 V/1.8 V/2.0 V on-board regulators
- Sequenced power supplies (Power on) - on board clocks
- 50 MHz (LVCMOS)
- 200 MHz (LVDS) - Power-on Reset IC for FPGA configuration
- User Switch x2 (Push x1, DIP x1bit)
- User LED x2
- Status LED x2 (Power, Done)
- High quality ten layer PCB. (Immersion gold)
- Credit-Card-Size 3.386"x 2.126" (86 x 54 mm)
- Tested all I/O
- RoHS compliance
- MADE IN JAPAN
Package Contents
Item | Image | Quantity |
---|---|---|
FPGA board (XCM-209-***) | 1 | |
Sockets (HIROSE 80P) | 2 | |
Sockets (HIROSE 100P) | 2 |
There is no paper document such as user's manual and circuit schematic in the package.
Please download those documents from the link in the documentation section below.
Documentation
Price and Accessories
Description | Model (order code) |
FPGA | List price (JPY) |
Stock Status |
---|---|---|---|---|
Kintex-7 FGG900 FPGA board | XCM-209-325T | XC7K325T-1FFG900C | ||
Kintex-7 FGG900 FPGA board | XCM-209-410T | XC7K410T-1FFG900C | ||
Universal board for ACM/XCM-1, 2 series (MAX 3.3 V) | ZKB-157 | - |
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