Heatsink for FPGA #2
MBA31001-X01 is an easy-to-mount heatsink for Kintex-7 FPGA FFG900 package.
Specifications
- Compatible with Kintex-7 FFG900
- Thermally conductive interface tape
- Fasten by a clip
- Manufacturer: Malico Inc.
MBA31001-13W/3.2Y+T710 - Dimension : 33.7 (X) x 33.2 (Y) x 13.2 (H) [mm]
- RoHS Compliant
Compatible products
| Item | Image |
|---|---|
| XCM-209 Series |  |
There is no paper document such as user's manual and circuit schematic in the package.
Please download those documents from the link in the documentation section below.
Documentation
Price and Add-ons
| Description | Model (order code) | List price (JPY) | Stock Status |
|---|---|---|---|
| Heatsink for FPGA #2 | MBA31001-X01 |
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EDA-013 is Intel Corp.'s High performance USB-FPGA Cyclone 10 LP board.
XCM-212L is an evaluation board equipped with a XILINX's high performance FPGA, Kintex-7 ( FBG676 package).