PCB-cross-section of the stamp size FPGA/CPLD modules

Last Updated: Wednesday, 10 December 2014


This picture is a PCB-cross-section of an edge side of the stamp size FPGA/CPLD modules.

This board is six layers. At the edge side, the top and the bottom planes are connected each other by through holes to increase the phisical strength for a stress of board warpage.

PLCC68 series


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